Uphuhliso olubaluleke kakhulu kushishino lwe-heterojunction ngo-2023 lube yimpumelelo ekunciphiseni ukusetyenziswa kwesilivere, nto leyo ephawula inyathelo elibalulekileyo ekunciphiseni iindleko kunye nokuphucula ukukhuphisana kweli candelo. Ukuqinisekiswa ngempumelelo kwezicelo zeemodyuli ze-heterojunction kwizityalo zamandla zasekhaya luphawu oluhle, nangona inzuzo yabavelisi ingekazinzi ngokupheleleyo.
NgoJuni ka-2024, iseli yokuqala ye-HJT+THL yaveliswa kwiZiko leMiboniso yeHlabathi kunye noPhando kunye noPhuhliso laseTongwei, kunye nophuhliso olukhulu kwi-gigawatt-scale copper interconnections olufunyenwe ngexesha lovavanyo lovavanyo. Amandla aphezulu okukhupha i-Dongfang Sunrise's heterojunction solar module afikelele kwi-767.38 Wp, kunye nokusebenza kakuhle kokuguqulwa kwemodyuli ye-24.70%, okubeka irekhodi elitsha.
Phakathi kokunyuka kwamaxabiso esilivere, ubuchwepheshe obufana nepeyinti yobhedu egqunywe ngesilivere, ubuchwepheshe be-0BB, kunye nokuprintwa kwestencil bubaluleke ngakumbi. Olu phuculo alunciphisi nje kuphela ukusetyenziswa kwesilivere kwiibhetri ze-HJT kodwa lukwaphucula ukusebenza kakuhle kokuguqulwa, nto leyo ephucula ngakumbi ukusebenza kakuhle kweteknoloji ye-HJT.
Imfuno yeenxalenye ze-heterojunction inyuke kakhulu, njengoko kungqinwa kukubhida okukhulu okuvela kwizityalo zamandla zasekhaya nakwiiodolo zaphesheya. Njengoko ukuthunyelwa kweenxalenye kufikelela kwi-8-10 GW ngo-2023, imfuno yemarike yetekhnoloji ye-heterojunction iyanda.
Ngowama-2024, ukuphucula ukusebenza kakuhle kwe-heterojunction kuye kwaba yinto engxamisekileyo kunokunciphisa iindleko, ingakumbi njengoko iteknoloji ye-TOPCon ihambela phambili ngokukhawuleza. Iteknoloji ye-heterojunction kufuneka iphucule ukuze ifikelele kuma-watts angama-30 olawulo lwamandla.
Imizamo yokunciphisa iindleko itshintshe ingqwalasela yaya ekunciphiseni okanye ekupheliseni ukusetyenziswa kwesilivere kwipeyinti yesilivere. Nokuba kwindawo yokulahlekelwa kushishino lonke, silindele ukuba iimveliso ezidibeneyo zibonise inzuzo, zigcine inzuzo ephezulu kunye nexabiso ngaphezu kweemveliso ze-TOPCon. Ingqwalasela yemarike ikwakwiindlela zokukhula kwabavelisi abaphambili, eziya kuba nefuthe kwisantya sotyalo-mali lweli candelo.
Utshintsho olubini olubalulekileyo olunxulumene neendleko luye lwenzeka kutshanje: ukwehla komxholo wesilivere wepeyinti kunye nemirhumo ephantsi yokucubungula ipeyinti yesilivere enobushushu obuphantsi. Uphuhliso lwetekhnoloji, ngakumbi oluvela kumvelisi wepeyinti waphesheya kwelizwe i-KE, lukhokelele ekuqalisweni ngempumelelo kwepeyinti yesilivere engama-30%, nto leyo enciphisa kakhulu iindleko. Ukongeza, ukudibanisa itekhnoloji ye-0BB kunye nepeyinti yesilivere engama-30% kunike itekhnoloji ye-heterojunction inzuzo ekusetyenzisweni kwesilivere ephantsi, nto leyo eyenza ukuba ikwazi ukumelana nokuguquguquka kwamaxabiso esilivere.
Nangona amaxabiso esilivere enyukayo enyusa iindleko zobuchwepheshe be-heterojunction, ukhuphiswano lwayo oluphambili lukwindlela esezantsi yokusebenzisa isilivere, nto leyo enciphisa iindleko zayo kwiinguqu zexabiso lesilivere. Nangona kunjalo, ukuphuculwa kwamandla kusabalulekile kuphuhliso lobuchwepheshe. Okwangoku, ubuchwepheshe be-heterojunction buphambi kwee-watts ezili-10 kuphela kune-TOPCon kwiimveliso eziphambili kwinguqulelo yama-210.
Kwikota ezi-2-3 ezizayo, ukuphuculwa kwamandla e-heterojunction kulindeleke ukuba kudlule i-TOPCon, eqhutywa kukuqhubela phambili kwi-PVD coating, i-secondary flocking, kunye netekhnoloji yokuprinta i-stencil. Ezi zinto zintsha kulindeleke ukuba ziphucule ukusebenza kakuhle kweeseli nge-0.6-0.7%, nto leyo ethetha ukuba malunga ne-15 watts yokuphucula amandla kwiimodyuli. Ukuprinta i-stencil yodwa kulindeleke ukuba kufake isandla ekuphuculweni kokusebenza kakuhle kwe-0.3% ngokuphucula iipaste zesilivere ezigqunywe yi-copper.
Itekhnoloji yefilimu ekhanyayo yenye into ebalulekileyo. Njengoko abavelisi abaninzi bengena kwimarike yefilimu ekhanyayo, ixabiso layo/ukusebenza kwayo liye laphucuka, kwaye iindleko ziye zehla, nto leyo enokubangela ukuba ibe yinkqubo eqhelekileyo kunyaka ophelileyo. Xa idibene nokuphuculwa kwebhetri, inzuzo yamandla e-heterojunction kune-TOPCon kulindeleke ukuba ibe ngaphezulu kwe-4% kwinguqulelo ye-210 kunye nee-watts ezingama-30 kwinguqulelo ye-20 ekupheleni kuka-2024.
I-power lead ye-2% ukuya kwi-5% kumjikelo ofanayo wokuhlaziya ubuchwepheshe inokunyusa iteknoloji ukusuka ekuveleni iye kwi-mainstream. Umahluko we-30-watts, ngokusekelwe kwiipatheni zembali zokuphindaphinda ubuchwepheshe, ubalulekile. Umzekelo, inzuzo yamandla ye-TOPCon ngaphezu kwe-PERC inyuke ukusuka kwi-10-15 watts (2%) ekupheleni kuka-2022 ukuya kwi-30 watts (5%) ekupheleni kuka-2023, nto leyo eyenza i-TOPCon ibe yiteknoloji ebalaseleyo.
I-4% yamandla inokubangela umjikelo omtsha wokwandiswa kwe-heterojunction. Izibhengezo zamva nje ze-TOPCon zibonisa ukuvuleleka kwitekhnoloji egqunywe ngesilivere kunye ne-copper-plated, kunye nokuphuculwa kokusebenza kakuhle kwemveliso, iindleko ezingezizo ze-silicon, kunye notyalo-mali lwezixhobo. Ukuba ukusebenza kakuhle kunye nolawulo lweendleko zomgca wamva nje we-GW ziyahlangabezana nolindelo, itekhnoloji ye-heterojunction iya kufumana iingenelo eziqinileyo zeendleko kunye nobukhulu.
Ingqwalasela mayigxile ekuthengisweni kwetekhnoloji yokuprinta istencil, ukuphuculwa kokusebenza kakuhle, kunye nokusetyenziswa kwamandla kwabavelisi abaphambili abanjengo-Orient Sunrise kunye neChain Rise Technology. Ukusebenza kwemali kwabavelisi abaphambili kwikota yesithathu kuya kuba luphawu olubalulekileyo lwempumelelo yokuthengiswa kwetekhnoloji ye-heterojunction.
