Iiseli ze-Photovoltaic (PV) zihlala zenziwe ngezinto ze-semiconductor ezifana ne-silicon kwaye zine-electrodes ezilungileyo nezingalunganga. Xa zibekwe elangeni, isiphumo se-photovoltaic siyenzeka, siguqula ngoko nangoko amandla okukhanya abe ngamandla ombane ngendlela ye-direct current (DC). Lo mbane unokugcinwa kwiibhetri okanye uguqulwe ube yi-alternating current (AC) nge-inverter ukuze kuhlangatyezwane neemfuno ezahlukeneyo zamandla. Iiseli ze-PV zihlala ziqhagamshelwe kuthotho okanye ngokuhambelana neemodyuli zefom, ezithi emva koko zihlanganiswe zibe zii-arrays ukuze kuphume amandla amakhulu.
1. Iiseli ze-Aluminium Back Surface Field (BSF)
Ulwakhiwo kunye noMgaqo
Iiseli ze-BSF luhlobo oluqhelekileyo lweeseli zelanga ezisebenzisa i-aluminium coating njenge-electrode yangasemva. Oku kwenza intsimi yombane engasemva enceda ukuqhuba ii-electron ziye kwi-electrode yangasemva, nto leyo ephucula ukusebenza kakuhle kokuguqulwa kwamandla. Inkqubo yemveliso ibandakanya ukufaka i-phosphorus kumphezulu we-silicon ukwenza ummandla wohlobo lwe-N, ukusebenzisa ifilimu okanye i-coating ukwenza ummandla wohlobo lwe-P ngaphambili, kunye nokwenza i-pn junction. Ekugqibeleni, iigridi zesinyithi zongezwa ukuqokelela umbane.
Imbali yoPhuhliso
Iiseli ze-BSF ezacetywa okokuqala ngo-1973, zazizezona zakhiwo zokuqala zeseli ze-silicon ezikristali ezithengiswayo. Ngo-2016, zazingaphezulu kwe-90% yesabelo semarike.
Iingenelo
Iiseli ze-BSF ziphawuleka ngokulula kwazo, ukusebenza kakuhle kweendleko, kunye nobuchwepheshe obuvuthiweyo.
2. Iiseli zePERC
Ukubiza Imvelaphi
I-PERC imele i-Passivated Emitter kunye ne-Rear Cell.
Inkqubo kunye nokusebenza
Ngokusebenzisa iiseli ze-BSF zemveli, iteknoloji ye-PERC yongeza amanyathelo amabini abalulekileyo: ukuthuthwa komphezulu ongasemva kunye nokuvulwa nge-laser, okunyusa kakhulu ukusebenza kakuhle. Inkqubo yokuvelisa ibandakanya ukucocwa kwe-wafer kunye nokuthungwa kwe-texturing, ukusasazwa ukwenza ii-pn junctions, ukufuthwa nge-laser kwi-emitters ezikhethiweyo, ukuthuthwa kwe-rear passivation, ukubhola nge-laser, ukuprinta isikrini, ukuthuthwa kwe-sintering, kunye novavanyo.
Iingenelo
Iiseli zePERC zinesakhiwo esilula, inkqubo yokwenziwa emfutshane, kunye nokuvuthwa okuphezulu kwezixhobo.
3. Iiseli zeHeterojunction (HJT)
Ulwakhiwo
Iiseli ze-HJT ziiseli zelanga ezixutyiweyo ezidibanisa ii-crystalline silicon substrates kunye neefilimu ze-silicon ezi-amorphous. Zibandakanya iileya ze-silicon ezi-amorphous zangaphakathi kwi-heterojunction interface ukuze zidlulise ubuso bangaphambili nangasemva. Isakhiwo esilinganayo siquka i-N-type crystalline silicon substrate, i-Pi amorphous silicon layer kwicala elijonge ukukhanya, i-iN amorphous silicon layer ngasemva, kunye nee-electrodes ezicacileyo kunye nee-busbars kumacala omabini. Ezi ziiseli ezimbini.
Iingenelo
Iiseli ze-HJT zisebenza kakuhle kakhulu, zinokonakala okuphantsi, zinomlinganiselo ophantsi wobushushu, zinobuso obuphezulu, zilula iinkqubo, kwaye zifanelekile kwii-wafers ezincinci.
4. Iiseli ze-TOPCon
Umgaqo woBugcisa
Iiseli ze-TOPCon (Tunnel Oxide Passivated Contact) zisekelwe kumgaqo wokuthwala okhethiweyo. Zinomaleko we-silicon oxide obhityileyo kakhulu kunye nomaleko we-silicon oxutyiweyo ngasemva, okwenza isakhiwo soqhagamshelwano esingenasithintelo. Oku kunciphisa ukuphinda-phindana komphezulu kunye noqhagamshelwano lwesinyithi, kudala amandla amakhulu okuphucula ukusebenza kakuhle kwiiseli ze-N-PERT.
Iimpawu zeNkqubo
Iiseli ze-TOPCon zisebenzisa ii-substrates ze-silicon zohlobo lwe-N kwaye zifuna utshintsho oluncinci kwimigca yemveliso yohlobo lwe-P ekhoyo, njengokongeza izixhobo zokusasazwa kwe-boron kunye ne-thin-film deposition. Zisusa isidingo sokuvuleka ngasemva kunye nokulungelelaniswa, zenza lula ukwenziwa kunye nokuphucula ukuhambelana neenkqubo zeeseli ze-PERC kunye ne-N-PERT.
Iingenelo
Iiseli ze-TOPCon zibonisa ukuwohloka okuphantsi, ubukhulu becala obuphezulu, kunye nomlinganiselo wobushushu obuphantsi, nto leyo enika ukusebenza okuhle kakhulu kwizityalo zamandla elanga.
5. Iiseli ze-IBC
Ulwakhiwo kunye noMgaqo
Iiseli ze-Interdigitated Back Contact (IBC) zihambisa zonke ii-grid ze-electrode ezikwicala langaphambili ziye ngasemva, zilungiselela ii-pn junctions kunye nee-metal contacts ngendlela ye-interdigitated pattern. Oku kunciphisa umbala kwaye kwandisa ukufunxwa kokukhanya. Ngaphandle kokunxibelelana kwesinyithi okukwicala langaphambili, iiseli ze-IBC zibonelela ngendawo enkulu esebenzayo yokuguqulwa kwe-photon.
Ukuhlanganiswa kobuChwepheshe
Iiseli ze-IBC zinokudityaniswa nezinye iiteknoloji ezifana ne-PERC, i-TOPCon, i-HJT, kunye ne-perovskite, zenze iiseli ezixutyiweyo eziphambili ezifana ne-"TBC" (TOPCon-IBC) kunye ne-"HBC" (HJT-IBC).
Isicelo Esinokwenzeka
Ngenxa yoyilo lwazo oluhle, ii-IBC cells zilungele kakuhle ii-photovoltaics ezidityanisiweyo zokwakha (BIPV) kwaye zinamathuba amakhulu orhwebo.
Isiphelo
Uhlobo ngalunye lweseli ye-PV lunezibonelelo ezikhethekileyo kwaye ludlala indima ebalulekileyo ekuphuculeni ubuchwepheshe bamandla elanga. Ngokusebenzisa ubuchule obuqhubekayo, obu buchwepheshe buqhuba ukukhula kunye notshintsho kwishishini le-photovoltaic.
